6AJ.1.2 Application Notes

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Back to 6AJ.1.2_Release_Notes

Poly Fix Silicon Identification

Locate (D) Date Code information
The Date Code is listed in YYWW format.
Material with date codes of 1327 or later are manufactured with the corrected poly slot reticle
There is a unique 7-character code (YMLLLLS) symbolized on the top of every component
YM in the code corresponds to the Year and Month of assembly
Units with lot trace code of 37LLLLS or later have been manufactured with the corrected poly slot reticle.
The test program revision is programmed as part of the die ID revision register.
Register to read is 0x4AE0C20C and The FT revision is found in bits [15:8]
If the value is 5 or more, it is poly fixed material


QSPI NOR/eMMC partitions

In this release, the xloader and boorloader goes into QSPI and rest of the images go in to eMMC partitions. The table below summarizes the partition info

Partition Info
Partition Name eMMC/QSPI Binary to flash
xloader QSPI MLO
bootloader QSPI u-boot.img
boot eMMC boot.img (zImage + ramdisk.img)
environment eMMC dra7-evm.dtb
system eMMC system.img
ipu eMMC dra7-ipu1-fw.xem4 (IPU1 binary for early boot camera)
data eMMC userdata.img


Syntax for fastboot flash command is

fastboot flash <partition name> <image file>

To update kernel (zImage) alone, flash the zimage partition

fastboot flash zimage <path to zImage>

To update ramdisk.img alone, you will have to create boot.img file and flash it. Steps to create boot.img file below

cd $YOUR_PATH/emmc_files
mkbootimg  --kernel <path/to/zImage> --ramdisk <path/to/ramdisk.img> --ramdisk_offset 0x01f00000 --base 0x80000000 --output boot.img


Note: To update MLO and u-boot.img in SPI, follow commands below. They have to be flashed together.

fastboot oem spi
fastboot flash xloader <MLO File>
fastboot flash bootloader <u-boot.img file>


Re-Building SGX kernel module

Some changes made to kernel defconfig can causes prebuilt SGX kernel module to not load

[    8.354095] pvrsrvkm_sgx544_116: disagrees about version of symbol thermal_cooling_device_register
[    8.363616] pvrsrvkm_sgx544_116: Unknown symbol thermal_cooling_device_register (err -22)
[    8.372467] pvrsrvkm_sgx544_116: disagrees about version of symbol thermal_zone_bind_cooling_device
[    8.382049] pvrsrvkm_sgx544_116: Unknown symbol thermal_zone_bind_cooling_device (err -22)
[    8.390869] pvrsrvkm_sgx544_116: disagrees about version of symbol pid_task
[    8.398254] pvrsrvkm_sgx544_116: Unknown symbol pid_task (err -22)
.
.

Follow the instructions below for rebuilding SGX module

cd ${MYDROID}/device/ti/proprietary-open/jacinto6/sgx_src/eurasia_km/eurasiacon/build/linux2/omap4430_android
export KERNELDIR=${YOUR_PATH}/kernel/android-3.8
export CROSS_COMPILE=${MYDROID}/prebuilts/gcc/linux-x86/arm/arm-eabi-4.7/bin/arm-eabi-
export ARCH=arm
make TARGET_PRODUCT="omap5sevm" BUILD=release TARGET_SGX=544es2

SGX module will be present at

${MYDROID}/device/ti/proprietary-open/jacinto6/sgx_src/eurasia_km/eurasiacon/binary2_544_116_omap4430_android_release/target/pvrsrvkm_sgx544_116.ko
or
${MYDROID}/out/target/product/jacinto6evm/target/kbuild/pvrsrvkm_sgx544_116.ko

Push this file to /system/lib/modules/ location on the target and reboot the board.


Audio

Below is some information about what input/output connectors in VayuEVM can be used for audio and what type of accessories can be connected.

INPUT
  • Microphone: 3.5mm jack on CPU board, labeled as “MIC IN” (P10). It’s assigned to Android’s built-in mic
    • Dedicated microphone with 3.5mm stereo plug has to be used
    • 3-pin plug: Tip -> Left channel, Ring -> Right channel, Sleeve -> Ground
    • Microphone can be mono but must have stereo plug. Microphone from phone headsets cannot be used
  • Back Microphone: 3.5 jack on JAMR3 board, labeled as “MIC1” (P7). It’s assigned to Android’s back mic
    • Dedicated microphone with 3.5mm stereo plug has to be used.
    • 3-pin plug: Tip -> NC, Ring -> Mono, Sleeve -> Ground
  • Line-In, Aux-In: Not used
OUTPUT
  • Cabin listening zone
    • Speaker: Default device for Cabin zone. Routed to Headphone / LineOut outputs in CPU board (no on-board speakers available)
      • Both outputs are 3.5mm jack, labeled as “HEADPHONE” (P13) and “LINE OUT” (P12)
      • 3-pin plug: Tip -> Left channel, Ring -> Right channel, Sleeve -> Ground
    • HDMI: Supports up to 8-channels, but only stereo and 5.1-channels are used in Android. JAMR3 inputs/outputs cannot seamlessly coexist with HDMI due to a board limitation, so HDMI can be assigned only to the Cabin zone. The default configuration of HDMI is stereo only (down-mix if necessary). 5.1-channels can be enabled by setting a system property: “multizone_audio.use_direct”.
  • Back-Seat1 listening zone
    • Headphone1: Routed to LineOut2 output in JAMR3 board. It’s a 3.5mm jack labeled as “LINE OUT2” (P10). Headphone1 is the default device of the Back-Seat1 listening zone.
    • BT A2DP: A2DP headphone can be paired/connected and assigned to any listening zone.
  • Back-Seat2 listening zone
    • Headphone2: Routed to LineOut3 output in JAMR3 board. It’s a 3.5mm jack labeled as “LINE OUT3” (P11). Headphone2 is the default device of the Back-Seat2 listening zone.


NOTE: Audio devices can be assigned to listening zones through the Settings -> Sound -> Audio Zone Configuration.


WiLink8Q

J2: WLAN/BT 2.4Ghz
J3: WLAN 5Ghz
J8: BT 2.4 Ghz

NOTE: Don't use Cybercom App and Android stock Bluetooth (Settings ⇒ Wireless & Metworks ⇒ Bluetooth) together


Ethernet

  shell@android:/$ su
  shell@android:/# netcfg eth0 up # to bring up the interface
  shell@android:/# netcfg eth0 dhcp # to get IP address from DHCP server
  shell@android:/# netcfg eth0 down # to bring down the interface


HDMI

• Mod is needed on RU108 module
• Lines 3B1 and 3B2 need to be shorted for HPD interrupt line to be connected all times
• Lines 4B1 and 4B2 need to be shorted for CEC interrupt line to be connected all times
• Refer to image here for details

Disable HDMI

In order to disable/remove HDMI from the system, apply the below kernel patch, rebuild and flash kernel. The patch below is to disable HDMI in kernel defconfig

cd ${YOUR_PATH}
git fetch http://review.omapzoom.org/kernel/omap refs/changes/37/34337/1 && git cherry-pick FETCH_HEAD


USB Super Speed

cd ${YOUR_PATH}/kernel/android-3.8
git fetch http://review.omapzoom.org/kernel/omap refs/changes/83/34283/1 && git cherry-pick FETCH_HEAD


DCAN

DCAN1_RX should be connected by populating R611 (0Ω)
cd ${MYDROID}/external
git clone https://git.gitorious.org/linux-can/can-utils.git


Multi Display

Two multi display configurations are supported in this release

  1. Primary LCD + HDMI panel
    • Default configuration
  2. Primary FPD Link + HDMI panel
    • Make sure you don't have JAMR board on your EVM
    • Requires kernel changes and u-boot changes for switching to this configuration
    • cd ${YOUR_PATH}/kernel/android-3.8
      # Kernel change to disable early IPU camera
      git fetch http://review.omapzoom.org/kernel/omap refs/changes/70/34270/2 && git cherry-pick FETCH_HEAD
      # Kernel change to make FPD Link primary display
      git fetch http://review.omapzoom.org/kernel/omap refs/changes/81/34281/1 && git cherry-pick FETCH_HEAD
      
      cd ${YOUR_PATH}/u-boot
      # U-boot change to disable early IPU camera
      git fetch http://review.omapzoom.org/repo/u-boot refs/changes/69/34269/2 && git cherry-pick FETCH_HEAD
      
    • Rebuild and flash kernel and u-boot components


VIP Single Instance


IPC


Boot Options

Default flashing instructions and script are meant for two stage bootloader (MLO & u-boot) with MLO and u-boot loading from QSPI and remaining content flashed to emmc. Instructions below are for other options enabled in this release.

SD card boot

SD Card Boot Information


USB Peripheral boot

This mode is for flashing a fresh new board, which has no MLO or u-boot present on SPI or eMMC (To avoid SD card)

SYSBOOT [0-15]
OFF OFF OFF OFF ON OFF OFF OFF    ON OFF OFF OFF OFF OFF OFF OFF ON
cd $YOUR_PATH/emmc_files
sudo ./usbboot-stand-alone -s ./u-boot-spl.bin
reading ASIC ID
CHIP: 5641
rom minor version: 01
IDEN: 0000000000000000000000000000000000000000
MPKH: 0000000000000000000000000000000000000000000000000000000000000000
CRC0: af96e165
CRC1: 00000000
device is GP
sending 2ndstage to target...
SYSBOOT [0-15]
OFF ON ON OFF OFF OFF OFF OFF    ON OFF OFF OFF OFF OFF OFF OFF ON


Single stage bootloader

To enable the early boot flow, configure the DRA7xx board to boot in QSPI_1 production boot mode by setting the sys_boot dip switches as follows:

SYSBOOT [0-15]
OFF ON ON OFF ON ON OFF OFF    ON OFF OFF OFF OFF OFF OFF OFF ON

Then power cycle the board. At boot when early boot mode is detected, SPL will load and boot necessary OS images into memory directly, bypassing u-boot load and execution.

If the SPL finds the required partitions/images, it will boot to the kernel; otherwise it falls back to regular flow of loading u-boot which allows user to flash partitions as needed.


All eMMC option

If you don't want to use QSPI NOR and want everything to be flashed to emmc and boot from emmc, follow instructions below.

echo "Setting target for bootloader to SPI"
${FASTBOOT} oem spi
SYSBOOT [0-15]
OFF ON OFF OFF OFF ON OFF OFF    ON OFF OFF OFF OFF OFF OFF OFF ON


Post release fixes

Domain Issue Fix Component
Audio Fix for Hot-pluggable device disconnection clears routes in zones where the device was not originally assigned http://review.omapzoom.org/34279 AFS


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